Track and analyze key semiconductor fabrication facility performance metrics focusing on yield, throughput, equipment effectiveness, and quality control to optimize manufacturing operations and maintain production targets.
Report Objective
Monitor and evaluate semiconductor fabrication facility performance across critical operational dimensions including production yield, equipment utilization, cycle time, and defect rates. This weekly analysis supports rapid identification of process deviations and manufacturing efficiency opportunities.
Production Yield and Output
Line chart showing weekly die yield percentage and wafer starts.
Questions to Consider:
How is overall yield trending compared to targets?
Are there specific process steps showing consistent yield losses?
What is the correlation between wafer starts and final yield?
What is the overall trend in die yield over the past quarter?
Are there any systematic patterns in yield fluctuations?
How does current yield compare to historical averages?
How stable is our weekly production volume?
Are we meeting planned wafer start targets?
What is the relationship between starts and yield?
Equipment Performance
Bar chart displaying equipment availability and OEE metrics
Questions to Consider:
Which tool groups are experiencing the most downtime?
How is preventive maintenance compliance affecting equipment reliability?
What is the impact of equipment performance on cycle time?
Which tool groups are showing the lowest availability?
How does availability impact overall fab performance?
Are maintenance schedules effectively maintaining availability?
Which tool groups have the lowest OEE?
How does OEE correlate with production bottlenecks?
What are the primary factors affecting OEE performance?
Quality and Defect Analysis
Scatter plot of defect density and critical dimension variation
Questions to Consider:
Are there emerging patterns in defect locations or types?
How do process parameters correlate with defect rates?
Which products or technologies show the highest quality concerns?
Is there a correlation between defect density and CD variation?
Which products or lots show concerning quality patterns?
Are process controls effectively maintaining quality targets?